View ADG791ACCPZ-REEL_704470.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

I2C-Compatible, Wide Bandwidth, Quad, 2:1 Multiplexer ADG791A/ADG791G
FEATURES
Bandwidth: 325 MHz Low insertion loss and on resistance: 2.6 typical On resistance flatness: 0.3 typical Single 3 V/5 V supply operation 3.3 V analog signal range (5 V supply, 75 load) Low quiescent supply current: 1 nA typical Fast switching times: tON = 186 ns, tOFF = 177 ns I2C(R)-compatible interface Compact 24-lead LFCSP ESD protection 4 kV human body model (HBM) 200 V machine model (MM) 1 kV field-induced charged device model (FICDM)
VDD
FUNCTIONAL BLOCK DIAGRAM
GND VDD GND
ADG791A
S1A D1 S1B S2A D2 S2B S3A D3 S3B S4A D4 S4B I2C SERIAL INTERFACE S4B S3B S4A S2B S3A S1B S2A S1A
ADG791G
D1
D2
D3
D4
I2C SERIAL INTERFACE
GPO1
06033-001
APPLICATIONS
S-video RGB/YPbPr video switches HDTVs Projection TVs DVD-R/RW AV receivers
A0 A1 A2 SDA SCL A0 A1 A2 SDA SCL
Figure 1.
GENERAL DESCRIPTION
The ADG791A/ADG791G are monolithic CMOS devices comprising four 2:1 multiplexers/demultiplexers controllable via a standard I2C serial interface. The CMOS process provides ultralow power dissipation yet gives high switching speed and low on resistance. The on-resistance profile is very flat over the full analog input range and wide bandwidth ensures excellent linearity and low distortion. These features, combined with a wide input signal range make the ADG791A/ADG791G the ideal switching solution for a wide range of TV applications including S-video, RGB, and YPbPr video switches. The switches conduct equally well in both directions when on. In the off condition, signal levels up to the supplies are blocked. The ADG791A/ADG791G switches exhibit break-before-make switching action. The ADG791G has one general-purpose logic output pin controlled by the I2C interface that can also be used to control other non-I2C-compatible devices such as video filters. The integrated I2C interface provides a large degree of flexibility in the system design. It has three configurable I2C address pins that allow up to eight devices on the same bus. This allows the user to expand the capability of the device by increasing the size of the switching array. The ADG791A/ADG791G operate from a single 3 V or 5 V supply voltage and is available in a compact 4 mm x 4 mm body, 24-lead LFCSP.
PRODUCT HIGHLIGHTS
1. 2. 3. 4. 5. 6. Wide bandwidth: 325 MHz. Ultralow power dissipation. Extended input signal range. Integrated I2C serial interface. Compact 4 mm x 4 mm, 24-lead, Pb-free LFCSP. ESD protection tested as per ESD association standards: 4 kV HBM (ANSI/ESD STM5.1-2001) 200 V MM (ANSI/ESD STM5.2-1999) 1 kV FICDM (ANSI/ESDSTM5.3.1-1999)
Rev. 0
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 (c)2006 Analog Devices, Inc. All rights reserved.
ADG791A/ADG791G TABLE OF CONTENTS
Features .............................................................................................. 1 Applications....................................................................................... 1 Functional Block Diagram .............................................................. 1 General Description ......................................................................... 1 Product Highlights ........................................................................... 1 Revision History ............................................................................... 2 Specifications..................................................................................... 3 I2C Timing Specifications............................................................ 7 Timing Diagram ........................................................................... 8 Absolute Maximum Ratings............................................................ 9 ESD Caution.................................................................................. 9 Pin Configurations and Function Descriptions ......................... 10 Typical Performance Characteristics ........................................... 11 Test Circuits..................................................................................... 14 Terminology .................................................................................... 16 Theory of Operation ...................................................................... 17 I2C Serial Interface ..................................................................... 17 I2C Address.................................................................................. 17 Write Operation.......................................................................... 17 LDSW Bit..................................................................................... 19 Power On/Software Reset.......................................................... 19 Read Operation........................................................................... 19 Evaluation Board ............................................................................ 20 Using the ADG791G Evaluation Board .................................. 20 Outline Dimensions ....................................................................... 23 Ordering Guide .......................................................................... 23
REVISION HISTORY
7/06--Revision 0: Initial Version
Rev. 0 | Page 2 of 24
ADG791A/ADG791G SPECIFICATIONS
VDD = 5 V 10%, GND = 0 V, TA = -40C to +85C, unless otherwise noted. Table 1.
Parameter ANALOG SWITCH Analog Signal Range 2 On Resistance, RON On-Resistance Matching Between Channels, RON On-Resistance Flatness, RFLAT (ON) LEAKAGE CURRENTS Source OFF Leakage (IS (OFF)) Drain OFF Leakage (ID (OFF)) Channel ON Leakage (ID (ON), IS (ON)) DYNAMIC CHARACTERISTICS 3 tON, tENABLE tOFF, tDISABLE Break-Before-Make Time Delay, tD I2C to GPO Propagation Delay, tH, tL Off Isolation Channel-to-Channel Crosstalk Same Multiplexer Different Multiplexer -3 dB Bandwidth THD + N Charge Injection CS (OFF) CD (OFF) CD (ON), CS (ON) Power Supply Rejection Ratio, PSRR Differential Gain Error Differential Phase Error LOGIC INPUTS3 A0, A1, A2 Input High Voltage, VINH Input Low Voltage, VINL Input Current, IINL or IINH Input Capacitance, CIN SCL, SDA Input High Voltage, VINH Input Low Voltage, VINL Input Leakage Current, IIN Input Hysteresis Input Capacitance, CIN Conditions VS = VDD, RL = 1 M VS = VDD, RL = 75 VD = 0 V, IDS = -10 mA, see Figure 22 VD = 0 V to 1 V, IDS = -10 mA, see Figure 22 VD = 0 V, IDS = -10 mA VD = 1 V, IDS = -10 mA VD = 0 V to 1 V, IDS = -10 mA VD = 4 V/1 V, VS = 1 V/4 V, see Figure 23 VD = 4 V/1 V, VS = 1 V/4 V, see Figure 23 VD = VS = 4 V/1 V, see Figure 24 CL = 35 pF, RL = 50 , VS = 2 V, see Figure 28 CL = 35 pF, RL = 50 , VS = 2 V, see Figure 28 CL = 35 pF, RL = 50 , VS1 = VS2 = 2 V, see Figure 29 (ADG791G only) f = 10 MHz, RL = 50 , see Figure 26 f = 10 MHz, RL = 50 , see Figure 27 Min 0 0 2.6 Typ 1 Max 4 3.3 3.5 4 0.5 0.6 0.55 Unit V V nA nA nA 250 240 130 -60 -55 -70 325 0.14 5 10 13 27 70 0.32 0.44 ns ns ns ns dB dB dB MHz % pC pF pF pF dB % Degrees
0.15 0.3 0.25 0.25 0.25 186 177 3
1
RL = 50 , see Figure 25 RL = 100 CL = 1 nF, VS = 0 V, see Figure 30
f = 20 kHz CCIR330 test signal CCIR330 test signal
2.0 VIN = 0 V to VDD 0.005 3 0.7 x VDD -0.3 VIN = 0 V to VDD 0.005 0.05 x VDD 3 0.8 1
V V A pF V V A V pF
VDD + 0.3 +0.3 x VDD 1
Rev. 0 | Page 3 of 24
ADG791A/ADG791G
Parameter LOGIC OUTPUTS3 SDA Pin Output Low Voltage, VOL Floating-State Leakage Current Floating-State Output Capacitance GPO1 Pin and GPO2 Pin Output Low Voltage, VOL Output High Voltage, VOH POWER REQUIREMENTS IDD Conditions Min Typ 1 Max Unit
ISINK = 3 mA ISINK = 6 mA
0.4 0.6 1 10 0.4 2.0 0.001 1 0.2 0.7
V V A pF V V A mA mA
ILOAD = +2 mA ILOAD = -2 mA Digital inputs = 0 V or VDD, I2C interface inactive I2C interface active, fSCL = 400 kHz I2C interface active, fSCL = 3.4 MHz
1 2
All typical values are at TA = 25C, unless otherwise stated. Guaranteed by initial characterization, not subject to production test. 3 Guaranteed by design, not subject to production test.
Rev. 0 | Page 4 of 24
ADG791A/ADG791G
VDD = 3 V 10%, GND = 0 V, TA = -40C to +85C, unless otherwise noted. Table 2.
Parameter ANALOG SWITCH Analog Signal Range 2 On Resistance, RON On-Resistance Matching Between Channels, RON On-Resistance Flatness, RFLAT (ON) LEAKAGE CURRENTS Source Off Leakage (IS (OFF)) Drain Off Leakage (ID (OFF)) Channel On Leakage (ID (ON), IS (ON)) DYNAMIC CHARACTERISTICS 3 tON, tENABLE tOFF, tDISABLE Break-Before-Make Time Delay, tD I2C to GPO Propagation Delay, tH, tL (ADG791G only) Off Isolation Channel-to-Channel Crosstalk Same Multiplexer Different Multiplexer -3 dB Bandwidth THD + N Charge Injection CS (OFF) CD (OFF) CD (ON), CS (ON) Power Supply Rejection Ratio, PSRR Differential Gain Error Differential Phase Error LOGIC INPUTS3 A0, A1, A2 Input High Voltage, VINH Input Low Voltage, VINL Input Current, IINL or IINH Input Capacitance, CIN SCL, SDA Input High Voltage, VINH Input Low Voltage, VINL Input Leakage Current, IIN Input Hysteresis Input Capacitance, CIN Conditions VS = VDD, RL = 1 M VS = VDD, RL = 75 VD = 0 V, IDS = -10 mA, see Figure 22 VD = 0 V to 1 V, IDS = -10 mA, see Figure 22 VD = 0 V, IDS = -10 mA VD = 1 V, IDS = -10 mA VD = 0 V to 1 V, IDS = -10 mA VD = 2 V/1 V, VS = 1 V/2 V, see Figure 23 VD = 2 V/1 V, VS = 1 V/2 V, see Figure 23 VD = VS = 2 V/1 V, see Figure 24 CL = 35 pF, RL = 50 , VS = 2 V, see Figure 28 CL = 35 pF, RL = 50 , VS = 2 V, see Figure 28 CL = 35 pF, RL = 50 , VS1 = VS2 = 2 V, see Figure 29 Min 0 0 3 Typ 1 Max 2.2 1.7 4 6 0.6 1.1 2.8 Unit V V nA nA nA 270 260 121 f = 10 MHz, RL = 50 , see Figure 26 f = 10 MHz, RL = 50 , see Figure 27 -60 -55 -70 310 0.14 2.5 10 13 27 70 0.28 0.28 ns ns ns ns dB dB dB MHz % pC pF pF pF dB % Degrees
0.15 0.8 0.25 0.25 0.25 198 195 3
1
RL = 50 , see Figure 25 RL = 100 CL = 1 nF, VS = 0 V, see Figure 30
f = 20 kHz CCIR330 test signal CCIR330 test signal
2.0 VIN = 0 V to VDD 0.005 3 0.7 x VDD -0.3 VIN = 0 V to VDD 0.005 0.05 x VDD 3 0.8 1
V V A pF V V A V pF
VDD + 0.3 +0.3 x VDD 1
Rev. 0 | Page 5 of 24
ADG791A/ADG791G
Parameter LOGIC OUTPUTS3 SDA Pin Output Low Voltage, VOL Floating-State Leakage Current Floating-State Output Capacitance GPO1 Pin and GPO2 Pin Output Low Voltage, VOL Output High Voltage, VOH POWER REQUIREMENTS IDD Conditions Min Typ 1 Max Unit
ISINK = 3 mA ISINK = 6 mA 3 ILOAD = +2 mA ILOAD = -2 mA Digital inputs = 0 V or VDD, I2C interface inactive I2C interface active, fSCL = 400 kHz I2C interface active, fSCL = 3.4 MHz
0.4 0.6 1
V V A pF V V A mA mA
0.4 2.0 0.001 1 0.1 0.2
1 2
All typical values are at TA = 25C, unless otherwise stated. Guaranteed by initial characterization, not subject to production test. 3 Guaranteed by design, not subject to production test.
Rev. 0 | Page 6 of 24
ADG791A/ADG791G
I2C TIMING SPECIFICATIONS
VDD = 2.7 V to 5.5 V; GND = 0 V; TA = -40C to +85C, unless otherwise noted. See Figure 2 for timing diagram. Table 3.
Parameter 1 fSCL Conditions Standard mode Fast mode High speed mode CB = 100 pF max CB = 400 pF max Standard mode Fast mode High speed mode CB = 100 pF max CB = 400 pF max Standard mode Fast mode High speed mode CB = 100 pF max CB = 400 pF max Standard mode Fast mode High speed mode Standard mode Fast mode High speed mode CB = 100 pF max CB = 400 pF max Standard mode Fast mode High speed mode Standard mode Fast mode High speed mode Standard mode Fast mode Standard mode Fast mode High speed mode Standard mode Fast mode High speed mode CB = 100 pF max CB = 400 pF max Standard mode Fast mode High speed mode CB = 100 pF max CB = 400 pF max Standard mode Fast mode High speed mode CB = 100 pF max CB = 400 pF max Min Max 100 400 3.4 1.7 4 0.6 60 120 4.7 1.3 160 320 250 100 10 0 0 0 0 4.7 0.6 160 4 0.6 160 4.7 1.3 4 0.6 160 20 + 0.1 CBB 10 20 20 + 0.1 CBB 10 20 20 + 0.1 CBB 10 20 Unit kHz kHz MHz MHz s s ns ns s s ns ns ns ns ns s s ns ns s s ns s s ns s s s s ns ns ns ns ns ns ns ns ns ns ns ns ns
Rev. 0 | Page 7 of 24
Description Serial clock frequency
t1
tHIGH, SCL high time
t2
tLOW, SCL low time
t3
tSU;DAT, data setup time
t4 2
3.45 0.9 703 150
tHD;DAT, data hold time
t5
tSU;STA, setup time for a repeated start condition
t6
tHD;STA, hold time (repeated) start condition
t7 t8
tBUF, bus free time between a stop and a start condition tSU;STO, setup time for stop condition
t9
1000 300 80 160 300 300 80 160 1000 300 40 80
tRDA, rise time of SDA signal
t10
tFDA, fall time of SDA signal
t11
tRCL, rise time of SCL signal
ADG791A/ADG791G
Parameter 1 t11A Conditions Standard mode Fast mode High speed mode CB = 100 pF max CB = 400 pF max Standard mode Fast mode High speed mode CB = 100 pF max CB = 400 pF max Fast mode High speed mode Min Max 1000 300 80 160 300 300 40 80 50 10 Unit ns ns ns ns ns ns ns ns ns ns Description tRCL1, rise time of SCL signal after a repeated start condition and after an acknowledge bit.
20 + 0.1 CBB 10 20 20 + 0.1 CBB 10 20 0 0
t12
tFCL, fall time of SCL signal
tSP
Pulse width of suppressed spike
1 2
Guaranteed by initial characterization. CB refers to capacitive load on the bus line, tr and tf measured between 0.3 VDD and 0.7 VDD. A device must provide a data hold time for SDA to bridge the undefined region of the SCL falling edge.
TIMING DIAGRAM
t11
SCL
t12
t2 t6 t4 t1 t3 t5 t10
t6
t8 t9
06033-002
SDA
t7
P S S P
Figure 2. Timing Diagram for 2-Wire Serial Interface
Rev. 0 | Page 8 of 24
ADG791A/ADG791G ABSOLUTE MAXIMUM RATINGS
TA = 25C, unless otherwise noted. Table 4.
Parameter VDD to GND Analog, Digital Inputs Continuous Current, S or D Peak Current, S or D Operating Temperature Range Industrial (B Version) Storage Temperature Range Junction Temperature JA Thermal Impedance 24-Lead LFCSP Lead Temperature, Soldering (10 sec) IR Reflow, Peak Temperature (<20 sec) Ratings -0.3 V to +6 V -0.3 V to VDD + 0.3 V or 30 mA, whichever occurs first 100 mA 300 mA (pulsed at 1 ms, 10% duty cycle max) -40C to +85C -65C to +150C 150C 30C/W 300C 260C
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Only one absolute maximum rating may be applied at any one time.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although this product features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
Rev. 0 | Page 9 of 24
ADG791A/ADG791G PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
GND VDD SDA SCL A0 A1 24 23 22 21 20 19 24 23 22 21 20 19 GND VDD SDA SCL A0 A1
S1A S1B D1 D2 S2B S2A
1 2 3 4 5 6
PIN 1 INDICATOR
TOP VIEW (Not to Scale)
ADG791A
18 17 16 15 14 13
A2 NC NC NC NC NC
S1A S1B D1 D2 S2B S2A
1 2 3 4 5 6
PIN 1 INDICATOR
TOP VIEW (Not to Scale)
ADG791G
18 17 16 15 14 13
A2 NC GPO1 NC NC NC
7 8 9 10 11 12
S3A S3B D3 D4 S4B S4A
06033-004
Figure 3. ADG791G Pin Configuration
Figure 4. ADG791A Pin Configuration
Table 5. ADG791A/ADG791G Pin Function Descriptions
Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 Mnemonic S1A S1B D1 D2 S2B S2A S3A S3B D3 D4 S4B S4A NC NC NC NC/GPO1 NC A2 A1 A0 SCL SDA VDD GND Description A-Side Source Terminal for Mux 1. Can be an input or output. B-Side Source Terminal for Mux 1. Can be an input or output. Drain Terminal for Mux 1. Can be an input or output. Drain Terminal for Mux 2. Can be an input or output. B-Side Source Terminal for Mux 2. Can be an input or output. A-Side Source Terminal for Mux 2. Can be an input or output. A-Side Source Terminal for Mux 3. Can be an input or output. B-Side Source Terminal for Mux 3. Can be an input or output. Drain Terminal for Mux 3. Can be an input or output. Drain Terminal for Mux 4. Can be an input or output. B-Side Source Terminal for Mux 4. Can be an input or output. A-Side Source Terminal for Mux 4. Can be an input or output. Not Internally Connected. Not Internally Connected. Not Internally Connected. Not Internally Connected for ADG791A/General-Purpose Logic Output 1 for ADG791G. Not Internally Connected. Logic Input. Sets Bit A2 from the least significant bit of the 7-bit slave address. Logic Input. Sets Bit A1 from the least significant bit of the 7-bit slave address. Logic Input. Sets Bit A0 from the least significant bit of the 7-bit slave address. Digital Input, Serial Clock Line. Open-drain input that is used in conjunction with SDA to clock data into the device. External pull-up resistor required. Digital I/O. Bidirectional, open-drain data line. External pull-up resistor required. Positive Power Supply Input. Ground (0 V) Reference.
Rev. 0 | Page 10 of 24
06033-003
NOTES 1. NC = NO CONNECT. 2. THE EXPOSED PAD MUST BE TIED TO GND.
NOTES 1. NC = NO CONNECT. 2. THE EXPOSED PAD MUST BE TIED TO GND.
S3A S3B D3 D4 S4B S4A
7 8 9 10 11 12
ADG791A/ADG791G TYPICAL PERFORMANCE CHARACTERISTICS
3.0 TA = 25C 1 CHANNEL VDD = 3.3V, RL = 1M VDD = 3V, RL = 1M
4.0 3.5 3.0 2.5
TA = 25C 1 CHANNEL
VDD = 5.0V VDD = 4.5V VDD = 5.5V
2.5
VDD = 2.7V, RL = 1M
OUTPUT SIGNAL (V)
2.0
VDD = 3.3V, RL = 75 VDD = 3V, RL = 75 VDD = 2.7V, RL = 75
RON ()
06033-005
1.5
2.0 1.5 1.0
1.0
0.5
0.5 0
0
INPUT SIGNAL (V)
VD (VS) (V)
Figure 5. Analog Signal Range, 3 V Supply
5.0 4.5 4.0
Figure 8. On Resistance vs. VD (VS), 5 V Supply
7
VDD = 5.5V, RL = 1M VDD = 5V, RL = 1M VDD = 5.5V, RL = 75 VDD = 4.5V, RL = 1M
TA = 25C 1 CHANNEL 6 VDD = 3V TA = +85C 5
OUTPUT SIGNAL (V)
3.5
2.5 2.0 1.5 1.0 0.5 0 0 1 2 3
VDD = 4.5V, RL = 75
RON ()
3.0
VDD = 5V, RL = 75
4 TA = -40C 3 TA = +25C 2 1
TA = 25C 1 CHANNEL
06033-006
INPUT SIGNAL (V)
VD (VS) (V)
Figure 6. Analog Signal Range, 5 V Supply
6
Figure 9. On Resistance vs. VD (VS) for Various Temperatures, 3 V Supply
4.5
TA = 25C 1 CHANNEL VDD = 2.7V
VDD = 3.0V
4.0 3.5
5
TA = +25C 1 CHANNEL VDD = 5V
TA = +85C TA = +25C TA = -40C
4
VDD = 3.3V
3.0
RON ()
3
RON ()
2.5 2.0 1.5 1.0
2
1 0.5 0 0
06033-007
VD (VS) (V)
VD (VS) (V)
Figure 7. On Resistance vs. VD (VS), 3 V Supply
Figure 10. On Resistance vs. VD (VS) for Various Temperatures, 5 V Supply
Rev. 0 | Page 11 of 24
06033-010
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
0
0.5
1.0
1.5
2.0
2.5
3.0
06033-009
4
5
6
0
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
06033-008
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
0
0.5
1.0
1.5
2.0
2.5
3.0
ADG791A/ADG791G
0 -0.5 -1.0 TA = 25C VDD = 3V VDD = 5V
0 TA = 25C VDD = 3V/5V
-20
CHARGE INJECTION (pC)
-1.5 -2.0 -2.5 -3.0 -3.5 -4.0 -4.5
CROSSTALK (dB)
-40
SAME MULTIPLEXER
-60 DIFFERENT MULTIPLEXER
-80
-100
06033-011
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
0.1
1
10
100
1000
SOURCE VOLTAGE (V)
FREQUENCY (MHz)
Figure 11. Charge Injection vs. Source Voltage
220
Figure 14. Crosstalk vs. Frequency
-1
210
-3
TA = 25C VDD = 5V
tON (3V)
ATTENUATION (dB)
200
tON/tOFF (ns)
tOFF (3V)
-5 -7 -9 -11
190
180
tON (5V) tOFF (5V)
170
-13 -15 0.01
-20
0
20
40
60
80
06033-012
0.1
1
10
100
1000
TEMPERATURE (C)
FREQUENCY (MHz)
Figure 12. tON/tOFF vs. Temperature
0 TA = 25C VDD = 3V/5V
Figure 15. Bandwidth
0 TA = 25C -10 1 CHANNEL VDD = 3V/5V -20 NO DECOUPLING CAPACITORS USED -30
PSRR (dB)
-20
OFF ISOLATION (dB)
-40
-40 -50 -60 -70 -80 -90
-60
-80
-100
06033-013
0.1
1
10
100
1000
0.001
0.01
0.1
1
10
100
1000
FREQUENCY (MHz)
FREQUENCY (MHz)
Figure 13. Off Isolation vs. Frequency
Figure 16. PSRR vs. Frequency
Rev. 0 | Page 12 of 24
06033-016
-120 0.01
-100 0.0001
06033-015
160 -40
06033-014
-5.0
-120 0.01
ADG791A/ADG791G
0.40 0.35 0.30
GPO VOLTAGE (V)
TA = 25C
6
TA = 25C
5
VDD = 5V 0.25 IDD (mA) 0.20 0.15 VDD = 3V 0.10 0.05 0 0.1
VDD = 5V 4
3 VDD = 3V 2
1
06033-017
0.6
1.1
1.6
2.1
2.6
3.1
-18
-16
-14
-12
-10
-8
-6
-4
-2
0
fCLK FREQUENCY (MHz)
LOAD CURRENT (mA)
Figure 17. IDD vs. fCLK Frequency
1.4 1.2 VDD = 5V 1.0 0.8
IDD (mA)
GPO VOLTAGE (V)
1.5 2.0 2.5
Figure 20. GPO VOH vs. Load Current
TA = 25C
TA = 25C VDD = 3V VDD = 5V
0.6 0.4 0.2 0 -0.2 VDD = 3V
1.0
0.5
06033-018
0
1
2
3
4
5
6
0
5
10
15
20
25
30
35
I2C LOGIC INPUT VOLTAGE (V)
LOAD CURRENT (mA)
Figure 18. IDD vs. I2C Logic Input Voltage (SDA, SCL)
120
Figure 21. GPO VOL vs. Load Current
PROPAGATION DELAY (ns)
115
110
tPHL (5V) tPLH (5V)
tPHL (3V)
105
tPLH (3V)
100
-20
0
20
40
60
80
TEMPERATURE (C)
Figure 19. I2C to GPO Propagation Delay vs. Temperature (ADG791G Only)
06033-019
95 -40
Rev. 0 | Page 13 of 24
06033-021
0
06033-020
0 -20
ADG791A/ADG791G TEST CIRCUITS
VDD
0.1F
IDS
SA
V1 S VS D
NETWORK ANALYZER 50 50 VS 50
SB
D
06033-022
RON = V1/IDS
VOUT 50
GND
06033-027
Figure 22. On Resistance
VDD
Figure 25. Bandwidth
0.1F NETWORK ANALYZER
IS (OFF) A VS S D ID (OFF) A
06033-023
S 50
50
50 VS
VD
D
50 VOUT 50
GND
06033-028
Figure 23. Off Leakage
VDD
Figure 26. Off Isolation
0.1F NETWORK ANALYZER
ID (ON) A VD NC = NO CONNECT
SX
50
50 VS
NC
S
D
06033-024
SY DY DX
50 VOUT RL 50
Figure 24. On Leakage
Figure 27. Channel-to-Channel Crosstalk
Rev. 0 | Page 14 of 24
06033-029
GND
50
50
ADG791A/ADG791G
CLOCK PULSES CORRESPONDING TO THE LDSW BITS SCL 5V 50% 50%
0.1F VOUT VDD S VS I2C INTERFACE SCL SDA SCL D RL 50 VOUT CL 35pF
90% 10%
tON
CLOCK PULSES CORRESPONDING TO THE LDSW BITS 50% 50%
tOFF
GND VGPO
90% 10%
06033-025
tH
tL
Figure 28. Switching Time
5V CLOCK PULSE CORRESPONDING TO THE LDSW BIT VDD D RL 50 I2C INTERFACE VOUT CL 35pF VOUT VS 80% SCL
0.1F
SA VS SB
tD
GND
Figure 29. Break-Before-Make Time Delay
5V VDD RS VS GND S D CL 1nF VOUT SWITCH OFF QINJ = CL x VOUT
06033-030
SWITCH ON VOUT
Figure 30. Charge Injection
Rev. 0 | Page 15 of 24
06033-026
SDA
SCL
ADG791A/ADG791G TERMINOLOGY
On Resistance (RON) The series on-channel resistance measured between the S and D pins. On Resistance Match (RON) The channel-to-channel matching of on resistance when channels are operated under identical conditions. On Resistance Flatness (RFLAT(ON)) The variation of on resistance over the specified range produced by the specified analog input voltage change with a constant load current. Channel Off Leakage (IOFF) The sum of leakage currents into or out of an off channel input. Channel On Leakage (ION) The current loss/gain through an on-channel resistance, creating a voltage offset across the device. Input Leakage Current (IIN, IINL, IINH) The current flowing into a digital input when a specified low level or high level voltage is applied to that input. Input/Output Off Capacitance (COFF) The capacitance between an analog input and ground when the switch channel is off. Input/Output On Capacitance (CON) The capacitance between the inputs or outputs and ground when the switch channel is on. Digital Input Capacitance (CIN) The capacitance between a digital input and ground. Output On Switching Time (tON) The time required for the switch channel to close. The time is measured from 50% of the falling edge of the LDSW bit to the time the output reaches 90% of the final value. Output Off Switching Time (tOFF) The time required for the switch to open. The time is measured from 50% of the falling edge of the LDSW bit to the time the output reaches 10% of the final value. I2C to GPO Propagation Delay (tH, tL) The time required for the logic value at the GPO pin to settle after loading a GPO command. The time is measured from 50% of the falling edge of the LDSW bit to the time the output reaches 90% of the final value for high and 10% for low. Total Harmonic Distortion + Noise (THD + N) The ratio of the harmonic amplitudes plus noise of a signal to the fundamental. -3 dB Bandwidth The frequency at which the output is attenuated by 3 dB. Off Isolation The measure of unwanted signal coupling through an off switch. Crosstalk The measure of unwanted signal that is coupled through from one channel to another as a result of parasitic capacitance. Charge Injection The measure of the glitch impulse transferred from the digital input to the analog output during on/off switching. Differential Gain Error The measure of how much color saturation shift occurs when the luminance level changes. Both attenuation and amplification can occur; therefore, the largest amplitude change between any two levels is specified and expressed in %. Differential Phase Error The measure of how much hue shift occurs when the luminance level changes. It can be a negative or positive value and is expressed in degrees of subcarrier phase. Input High Voltage (VINH) The minimum input voltage for Logic 1. Input Low Voltage (VINL) The maximum input voltage for Logic 0. Output High Voltage (VOH) The minimum output voltage for Logic 1. Output Low Voltage (VOL) The maximum output voltage for Logic 0. IDD Positive supply current.
Rev. 0 | Page 16 of 24
ADG791A/ADG791G THEORY OF OPERATION
The ADG791A/ADG791G are monolithic CMOS devices comprising four 2:1 multiplexers controllable via a standard I2C serial interface. The CMOS process provides ultralow power dissipation, yet offers high switching speed and low on resistance. The on resistance profile is very flat over the full analog input range, and wide bandwidth ensures excellent linearity and low distortion. These features, combined with a wide input signal range, make the ADG791A/ADG791G an ideal switching solution for a wide range of TV applications. The switches conduct equally well in both directions when on. In the off condition, signal levels up to the supplies are blocked. The integrated serial I2C interface controls the operation of the switches (ADG791A/ADG791G) and general-purpose logic pins (ADG791G only). The ADG791A/ADG791G have many attractive features, such as the ability to individually control each multiplexer, the option of reading back the status of any switch. The ADG791G has one general-purpose logic output pin controllable through the I2C interface. The following sections describe these features in detail. 3. Data transmits over the serial bus in sequences of nine clock pulses (eight data bits followed by an acknowledge bit). The transitions on the SDA line must occur during the low period of the clock signal, SCL, and remain stable during the high period of SCL. Otherwise, a low-to-high transition when the clock signal is high can be interpreted as a stop event that ends the communication between the master and the addressed slave device. After transferring all data bytes, the master establishes a stop condition, defined as a low-to-high transition on the SDA line while SCL is high. In write mode, the master pulls the SDA line high during the 10th clock pulse to establish a stop condition. In read mode, the master issues a no acknowledge for the ninth clock pulse (the SDA line remains high). The master then brings the SDA line low before the 10th clock pulse, and then high during the 10th clock pulse to establish a stop condition.
4.
I2C ADDRESS
The ADG791A/ADG791G has a 7-bit I2C address. The four most significant bits are internally hardwired while the last three bits (A0, A1, and A2) are user-adjustable. This allows the user to connect up to eight ADG791As/ADG791Gs to the same bus. The I2C bit map shows the configuration of the address.
I2C SERIAL INTERFACE
The ADG791A/ADG791G are controlled via an I2C-compatible serial bus interface (refer to the I2C-Bus Specification available from Philips Semiconductor) that allows the part to operate as a slave device (no clock is generated by the ADG791A/ADG791G). The communication protocol between the I2C master and the device operates as follows: 1. The master initiates data transfer by establishing a start condition (defined as a high-to-low transition on the SDA line while SCL is high). This indicates that an address/data stream follows. All slave devices connected to the bus respond to the start condition and shift in the next eight bits, consisting of a 7-bit address (MSB first) plus an R/W bit. This bit determines the direction of the data flow during the communication between the master and the addressed slave device. The slave device whose address corresponds to the transmitted address responds by pulling the SDA line low during the ninth clock pulse (this is known as the acknowledge bit). At this stage, all other devices on the bus remain idle while the selected device waits for data to be written to, or read from, its serial register. If the R/W bit is set high, the master reads from the slave device. However, if the R/W bit is set low, the master writes to the slave device.
7-Bit I2C Address Configuration
MSB 1 0 1 0 A2 A1 LSB A0
WRITE OPERATION
When writing to the ADG791A/ADG791G, the user must begin with an address byte and R/W bit, after which time the switch acknowledges that it is prepared to receive data by pulling SDA low. Data is loaded into the device as a 16-bit word under the control of a serial clock input, SCL. Figure 31 illustrates the entire write sequence for the ADG791A/ ADG791G. The first data byte (AX7 to AX0) controls the status of the switches while the LDSW and RESETB bits from the second byte control the operation mode of the device. Table 6 shows a list of all commands supported by the ADG791A/ADG791G with the corresponding byte that needs to be loaded during a write operation. To achieve the desired configuration, one or more commands can be loaded into the device. Any combination of the commands listed in Table 6 can be used with these restrictions: * * Only one switch from a given multiplexer can be ON at any given time When a sequence of successive commands affect the same element (that is, the switch or GPO pin), only the last command is executed.
2.
Rev. 0 | Page 17 of 24
ADG791A/ADG791G
SCL SDA START CONDITION BY MASTER ADDRESS BYTE ACKNOWLEDGE BY SWITCH ACKNOWLEDGE BY SWITCH A2 A1 A0 R/W AX7 AX6 AX5 AX4 AX3 AX2 AX1 AX0 X X X X X X RESETB LDSW
STOP CONDITION BY MASTER
06033-031
ACKNOWLEDGE BY SWITCH
Figure 31. Write Operation
Table 6. ADG791A/ADG791G Command List
AX7 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 X1 X1 X1 X1 X1 X1 X1 X1 X1 X1 1 0 0 1
1
AX6 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0
AX5 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0
AX4 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1
AX3 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 1 1 0 0 0 0 0 0 1 1
AX2 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 0 0 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1
AX1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1
AX0 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 1 0 1 0 1 0 1 0 1 0 0 1 1
Addressed Switch S1A/D1, S2A/D2, S3A/D3, S4A/D4 off S1A/D1, S2A/D2, S3A/D3, S4A/D4 on S1B/D1, S2B/D2, S3B/D3, S4B/D4 off S1B/D1, S2B/D2, S3B/D3, S4B/D4 on S1A/D1 off S1A/D1 on S1B/D1 off S1B/D1 on S2A/D2 off S2A/D2 on S2B/D2 off S2B/D2 on S3A/D3 off S3A/D3 on S3B/D3 off S3B/D3 on S4A/D4 off S4A/D4 on S4B/D4 off S4B/D4 on Reserved Reserved Reserved Reserved Mux 1 disabled (all switches connected to D1 are off ) Mux 2 disabled (all switches connected to D2 are off ) Mux 3 disabled (all switches connected to D3 are off ) Mux 4 disabled (all switches connected to D4 are off ) Reserved Reserved GPO1 high for ADG791G/reserved for ADG791A GPO1 low for ADG791G/reserved for ADG791A All muxes disabled Reserved
X = Logic state does not matter.
Rev. 0 | Page 18 of 24
ADG791A/ADG791G
LDSW BIT
The LDSW bit allows the user to control the way the device executes the commands loaded during the write operations. The ADG791A/ADG791G executes all the commands loaded between two successive write operations that have set the LDSW bit high. Setting the LDSW high for every write cycle ensures that the device executes the command right after the LDSW bit was loaded into the device. This setting can be used when the desired configuration can be achieved by sending a single command or when the switches and/or GPO pin are not required to be updated at the same time. When the desired configuration requires multiple commands with simultaneous update, the LDSW bit should be set low while loading the commands except the last one when the LDSW bit should be set high. Once the last command with LDSW = high is loaded, the device executes all commands received since the last update simultaneously.
READ OPERATION
When reading data back from the ADG791A/ADG791G, the user must begin with an address byte and R/W bit. The switch then acknowledges that it is prepared to transmit data by pulling SDA low. Following this acknowledgement, the ADG791A/ADG791G transmits two bytes on the next clock edges. These bytes contain the status of the switches, and each byte is followed by an acknowledge bit. A logic high bit represents a switch in the on (close) state while a low represents a switch in the off (open) state. For the GPO pin (ADG791G only), the bit represents the logic value of the pin. Figure 32 illustrates the entire read sequence. The bit maps accompanying Figure 32 show the relationship between the elements of the ADG791A and ADG791G (that it, the switches and GPO pins) and the bits that represent their status after a completed read operation.
POWER ON/SOFTWARE RESET
The ADG791A/ADG791G has a software reset function implemented by the RESETB bit from the second data byte written to the device. For normal operation of the multiplexers and GPO pin, this bit should be set high. When RESETB = low or after power-up, the switches from all multiplexers are turned off (open) and the GPO pin is set low.
ADG791A Bit Map
RB15 S1A/D1 RB14 S1B/D1 RB13 S2A/D2 RB12 S2B/D2 RB11 S3A/D3 RB10 S3B/D3 RB9 S4A/D4 RB8 S4B/D4 RB7 RB6 RB5 RB4 RB3 RB2 RB1 RB0 -
ADG791G Bit Map
RB15 S1A/D1 RB14 S1B/D1 RB13 S2A/D2 RB12 S2B/D2 RB11 S3A/D3 RB10 S3B/D3 RB9 S4A/D4 RB8 S4B/D4 RB7 RB6 RB5 RB4 RB3 GPO1 RB2 RB1 RB0 -
SCL A2 ADDRESS BYTE ACKNOWLEDGE BY SWITCH ACKNOWLEDGE BY SWITCH A1 A0 R/W RB15 RB14 RB13 RB12 RB11 RB10 RB9 RB8 RB7 RB6 RB5 RB4 RB3 RB2 RB1 RB0
SDA START CONDITION BY MASTER
ACKNOWLEDGE BY SWITCH
Figure 32. ADG791A/ADG791G Read Operation
Rev. 0 | Page 19 of 24
06033-032
STOP CONDITION BY MASTER
ADG791A/ADG791G EVALUATION BOARD
The ADG791G evaluation kit allows designers to evaluate the high performance of the device with a minimum of effort. The evaluation kit includes a printed circuit board populated with the ADG791G. The evaluation board can be used to evaluate the performance of both the ADG791A and ADG791G. It interfaces to the USB port of a PC, or it can be used as a standalone evaluation board. Software is available with the evaluation board that allows the user to easily program the ADG791G through the USB port. Schematics of the evaluation board are shown in Figure 33 and Figure 34. The software runs on any PC that has Microsoft(R) Windows(R) 2000 or Windows XP installed.
USING THE ADG791G EVALUATION BOARD
The ADG791G evaluation kit is a test system designed to simplify the evaluation of the device. Each input/output of the part comes with a socket specifically chosen for easy audio/video evaluation. A data sheet is also available and gives full information on operating the evaluation board.
Rev. 0 | Page 20 of 24
3.3V 3.3V T1 3.3V 3.3V 24LC64
8
C22 0.1F R1 2.2k R2 2.2k
J2-1 3.3V R7 0
J2-2
R5 75 C18 0.1F U2
3 7 11 17 27 32 43 55
R6 75 C23 2.2F 3.3V VCC 7 WP 6 SCL 5 VSS SDA
1 A0 2 A1 3 A2 4
T4
C4 10F
C9 0.1F
AVCC VCC VCC VCC VCC VCC VCC VCC
42
3.3V SCL_EN R12 2.2k G S Q1 D G T27 T28 S U4
1 2
VDD R9 2.2k
J1 USB-MINI-B
44 1 2 9 8 3 4 5 54
VBUS D- D+ IO GND *DENOTES PROGRAMMABLE POLARITY.
16 15 4 5
SHIELD
R31 10k
R32 10k
SDA
33 34 35 36 37 38 39 40 1 2 13 14
18 19 20 21 22 23 24 25 45 46 47 48 49 50 51 52 29 30 31
Q2
D
SCL
R10 10k
10 12 26 28 41 53 56
VDD
6
C6 0.1F C8 0.1F C20 0.1F
AGND
GND GND GND GND GND GND GND
06033-033
Figure 33. EVAL-ADG791GEB Schematic, USB Controller Section
3.3V
ADG821
S1 D1
3
3.3V VDD IN1 IN2 XTAL1 24MHz
4 8 7
Rev. 0 | Page 21 of 24
C5 0.1F C19 0.1F C21 0.1F C7 0.1F C17 22pF B T26 3.3V
C2 0.1F SCL_EN D2 GND C10 22pF S2
6 5
PB0/FD0 PB1/FD1 PB2/FD2 PB3/FD3 RESET PB4/FD4 *WAKEUP PB5/FD5 PB6/FD6 CLKOUT PB7/FD7 U3 PD0/FD8 CY7C68013-CS P PD1/FD9 D- PD2/FD10 PD3/FD11 D+ PD4/FD12 PA0/INT0 PD5/FD13 PA1/INT1 PD6/FD14 PA2/*SLOE PD7/FD15 PA3/*WU2 CTL0/*FLAGA PA4/FIFOADR0 CTL1/*FLAGB PA5/FIFOADR1 PA6/*PKTEND CTL2/*FLAGC PA7/*FLD/SLCS SDA RDY0/*SLRD SCL RDY1/*SLWR IFCLK XTALOUT RSVD XTALIN
J5
A
ADP3303-3.3
8 7 IN2 5
IN1 C14 10F C16 0.1F
1
C13 10F
C3 0.1F
OUT1 2 OUT2 6 SD ERROR 3 GND NR 4 U5
C15 0.1F
R11 1k D4
ADG791A/ADG791G
3.3V
1 4 5
K7
T15 T14 T13 T12 T11 T10
GND 2 BOTTOM 3 CASE TOP CASE
R25
PHONO_DUAL R26
T18
1 4 5
K8 R27
GND 2 BOTTOM 3 CASE TOP CASE
PHONO_DUAL
R28
T20
T22 T23
PADDLE
1 4 5
K9 GND 2 BOTTOM 3 CASE TOP CASE R29
GPO1
R36 0
PHONO_DUAL R30
06033-034
ADG791A/ADG791G
Figure 34. EVAL-ADG791GEB Schematic, Chip Section
Rev. 0 | Page 22 of 24
4 1 1 4 1
K6
K5
K4
PHONO_DUAL
PHONO_DUAL
PHONO_DUAL
GND 2 BOTTOM 3 CASE TOP 5 CASE
GND 2 BOTTOM 4 3 CASE TOP 5 CASE
GND 2 BOTTOM 3 CASE TOP 5 CASE
GPO2 R24 T16 T17 T19 T21 SDA SCL
R23 A
12 11 10 9 8 7 25
R22
R21 T2 T3
R20
R19
R13
PHONO_DUAL
5
2
CASE 3 TOP 4 CASE BOTTOM 1 GND R14 K3
R15
PHONO_DUAL
5
6 5 4 3 2 1
13 14 15 16 17 18
ADG791G
2
R34 0 R35 0
A
CASE 3 TOP 4 CASE BOTTOM 1 GND K2
R3 10k
R4 10k
R8 10k
U1
19 20 21 22 23 24
R16 R17
PHONO_DUAL
5
T24
2
T7 T25 T8 T9
CASE 3 TOP 4 CASE BOTTOM 1 GND K1 R18
J3
J7
J8
GPO2
GPO1
T5 T6 J6-3 J6-2 J6-1 SCL
SDA
C1 0.1F VDD
J4-2
J4-3
J4-1
SCL SDA
ADG791A/ADG791G OUTLINE DIMENSIONS
4.00 BSC SQ 0.60 MAX 0.60 MAX 0.50 BSC 0.50 0.40 0.30 1.00 0.85 0.80 12 MAX 0.80 MAX 0.65 TYP
19 18 EXPOSED PAD 24 1
PIN 1 INDICATOR *2.45 2.30 SQ 2.15
6
PIN 1 INDICATOR
TOP VIEW
3.75 BSC SQ
(BO TTOMVIEW)
13 12
7
0.23 MIN 2.50 REF
0.05 MAX 0.02 NOM 0.20 REF COPLANARITY 0.08
SEATING PLANE
0.30 0.23 0.18
*COMPLIANT TO JEDEC STANDARDS MO-220-VGGD-2 EXCEPT FOR EXPOSED PAD DIMENSION
Figure 35. 24-Lead Lead Frame Chip Scale Package [LFCSP_VQ] 4 mm x 4 mm Body, Very Thin Quad (CP-24-2) Dimensions shown in millimeters
ORDERING GUIDE
Model ADG791ABCPZ-REEL 1 ADG791ABCPZ-500RL71 ADG791ACCPZ-REEL1 ADG791ACCPZ-500RL71 ADG791GBCPZ-REEL1 ADG791GBCPZ-500RL71 ADG791GCCPZ-REEL1 ADG791GCCPZ-500RL71 EVAL-ADG791GEB 2
1 2
Temperature Range -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C
I2C Speed 100 kHz, 400 kHz 100 kHz, 400 kHz 100 kHz, 400 kHz, 3.4 MHz 100 kHz, 400 kHz, 3.4 MHz 100 kHz, 400 kHz 100 kHz, 400 kHz 100 kHz, 400 kHz, 3.4 MHz 100 kHz, 400 kHz, 3.4 MHz
Package Description 24-Lead LFCSP_VQ 24-Lead LFCSP_VQ 24-Lead LFCSP_VQ 24-Lead LFCSP_VQ 24-Lead LFCSP_VQ 24-Lead LFCSP_VQ 24-Lead LFCSP_VQ 24-Lead LFCSP_VQ Evaluation Board
Package Option CP-24-2 CP-24-2 CP-24-2 CP-24-2 CP-24-2 CP-24-2 CP-24-2 CP-24-2
Z = Pb-free part. Evaluation board is RoHS compliant.
Rev. 0 | Page 23 of 24
ADG791A/ADG791G NOTES
Purchase of licensed I2C components of Analog Devices or one of its sublicensed Associated Companies conveys a license for the purchaser under the Philips I2C Patent Rights to use these components in an I2C system, provided that the system conforms to the I2C Standard Specification as defined by Philips.
(c)2006 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D06033-0-7/06(0)
Rev. 0 | Page 24 of 24

▲Up To Search▲

Price & Availability of ADG791ACCPZ-REEL

	To Download ADG791ACCPZ-REEL Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .